An electrode formed through the semiconductor wafer (chip) from the front to back surface. The metal part of the electrode is formed mainly of Cu. *2) Grinding: A process in which a grinding wheel ...

It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry ...

Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates.

(MENAFN- EIN Presswire) Porter's five forces analysis illustrates the potency of the buyers and the wafer backgrinding tape market share of key vendors wafer backgrinding tape market analysis Asia ...