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elektormagazine
1 天
The Fnirsi LCR-P1 Transistor Tester, a Surprising Device (Review)
The Fnirsi LCR-P1 transistor tester can test much more than just transistors. Diodes and passive components are supported, ...
Taiwan News
2 天
Vietnam Insulated Gate Bipolar Transistors And Metal Oxide Field Effect Transistor Market ...
Vietnam Insulated Gate Bipolar Transistors And Metal Oxide Field Effect Transistor Market Key Takeaways: The Vietnam Insulated Gate Bipolar Transistors (IGBT) and Metal Oxide Field Effect Transistor ...
EDN
2 天
Mitsubishi samples high-voltage IGBT modules
Mitsubishi announced that it has begun shipping samples of two S1-Series high-voltage IGBT modules rated at 1.7 kV.
2 天
New Fab Process Can Boost Intel Stock
Binary code displayed on a laptop screen and Intel logo displayed on a phone screen are seen in this ... [+] illustration ...
Semiconductor Engineering
3 天
Schottky Barrier Transistors: Status, Challenges and Modeling Tools
A technical paper titled “Roadmap for Schottky barrier transistors” was published by researchers at University of Surrey, ...
Compoundsemiconductor.net
3 天
Na‑flux method improves GaN device performance
The simultaneous growth of large quantities of GaN crystals achieved using the ammonothermal method can also reduce ...
Fudzilla
4 天
Nvidia and TSMC team up on a silicon photonics chip prototype
Boldly going Nvidia and TSMC have developed a silicon photonics-based chip prototype, according to a recent report from the ...
Electronic Design
5 天
So...The CMOS Circuits in Our Texts Go Back to 1963?
Mostly-Analog editor Andy Turudic takes a look at the original 1963 ISSCC paper that described the world’s first CMOS process ...
Electronic Design
5 天
For Designers: Logic Nets in Transistor Cans (ED article from 1961)
Here’s a blast from the past as we reprint our news from NYC’s 1961 IRE show—the first integrated logic circuits in TO-5 and ...
Hackaday
9 天
New Years Circuit Challenge: Make This RFID Circuit
It’s the end of the year, and a few hardy souls gather in a hackerspace to enjoy a bit of seasonal food and hang out.
9 天
DRAM manufacturers explore new designs to overcome 3D stacking hurdles
While flash memory has made significant strides in capacity through monolithic 3D processing, DRAM has faced challenges in ...
9 天
Using 2D materials on chips without destroying the wiring
One way around this problem is to replace silicon with graphene-like 2D materials that maintain their semiconducting ...
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